1.
Barrier Coat (BC) Materials
Barrier Coat (BC), Thickness@4000 rpm, CEM product. BC-5.0, 950 ± Å, 365WSHR, 388WS, 388PG, 420WS, 420WSF. BC-7.5, 4500 ± Å, 388SS, 420SS ...
2.
Barrier Coat (BC) Materials
Barrier Coat (BC), Thickness@4000 rpm, CEM product. BC-5.0, 950 ± Å, 365WSHR, 388WS, 388PG, 420WS, 420WSF. BC-7.5, 4500 ± Å, 388SS, 420SS ...
3.
Barrier Coat (BC) Materials
Barrier coats are thin transparent polymer films spin coated directly over the photoresist surface after softbake. Shin-Etsu MicroSi offers the following ...
4.
Thermal Grease, Interface and Phase Change Material, Heatsink Compound
Thermal Conductivity(W/m °K), 4.5. Thermal Grease G-751 is available in: Syringes; Cartridges; Bulk; Custom Sizes Available. 0.5 gm, 1.0 gm, 1.5 gm ...
5.
Thermal Interface Materials
We have developed thermal solutions and are the recognized as the world leader in thermal interface material (TIM) applications. ...
6.
Thermal Grease, Interface and Phase Change Material, Heatsink Compound
Shin-Etsu MicroSi’s thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability.
7.
Thermal Gel
This highly thermal conductive gel has been successfully used throughout the semiconductor industry on temperature sensitive components. ...
8.
Thermal Grease, Interface and Phase Change Material, Heatsink Compound
This highly thermal conductive grease has been successfully used on CPUs, GPUs, PLCs and other temperature sensitive components. G-751 Data Sheet 114KB ...
9.
Thermal Pads
Shin-Etsu MicroSi’s thermally conductive rubber composite products are designed to enhance heat dissipation. These silicone based products have the ...
10.
Thermal Pads
Shin-Etsu MicroSi’s thermally conductive rubber composite products are designed to enhance heat dissipation. These silicone based products have the ...
