Automated Test Equipment
Platforms: Teradyne/Eagle Test/Nextest,
Advantest/Verigy, LTX/Credence & more
nexlogic.com/ATE/Board-Assembly
Consigned & Turn-key Assembly
Low to Medium Volume PCB Manufacturing in
the USA Since '95. Get a Quote today!
nexlogic.com/PCB/Manufacturing
Hi Speed, Analog/Digital, RF
Full Turn-Key Complex PCB Design.
Prototype & Custom. Contact Us Today!
nexlogic.com/PCB/Design
High-end Micro-packaging
Wire/Wedge Bonding, Flip Chip, COB, ACF
Bonding, IoT, Wearables, Die Attach
nexlogic.com/Micro/Electronics
Automated Test Equipment
Platforms: Teradyne/Eagle Test/Nextest,
Advantest/Verigy, LTX/Credence & more
nexlogic.com/ATE/Board-Assembly
High-end Micro-packaging - NexLogic.com
Advanced Packaging Solutions. Free
Micro-package Design Review!
nexlogic.com/MicroElectronics
Automated Test Equipment
Platforms: Teradyne/Eagle Test/Nextest,
Advantest/Verigy, LTX/Credence & more
nexlogic.com/ATE/Board-Assembly
High-end Micro-packaging
Wire/Wedge Bonding, Flip Chip, COB, ACF
Bonding, IoT, Wearables, Die Attach
nexlogic.com/Micro/Electronics