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tebga
teBGA {thermal enhanced}. Package Key Features. Liquid encapsulation protection; No D/A Material; Unique and optimized Cu paste process/material ...
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聯測科技United Test Center INC.
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wbga_windows
wBGA™ {window BGA}. { US PAT: 619.0943 }. Key Features. Cost competitive for high performance DRAM; JEDEC standard configuration - 60 balls ...
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